FLP Wafer 1700
Interview
Parameters
| Value | Unit | |
| Tool holders | Inch | 22 |
| Number of rotor discs | pcs. | 4-8 |
| PLC/TFT display | S7 1500 Siemens, modularly expandable | |
| Speed upper polishing disc | RPM | 3 -30 |
| Speed lower polishing disc | RPM | 3-30 |
| Rotation speed | RPM | 3-30 |
| Dimensions(L*W*H) | mm | approx.3200*2400*3000 |
| Weight | KG | approx. 8600kg |
| Sound pressure level | db | ∠70db |
| Control | intuitive Operator guidance |
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Product Detail
Waffer-double side polishing machine
Machining:
Silicon prime wafers, gallium arsenide, silicon carbide, sapphire and other substrates
Bacic Machine:
FEM-calculated designs, highly vibration damping, chemically resistant design, polyacrylic cover, doords floating, sensory interior monitoring, improved cleanroom suitability
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XIAMEN XIONGLIN Mechanical EQUIPMENT Co., Ltd
Huoju gaoxinqu ruanjianyuan (Software Park)Sanqi xixi shanwei Road No.63, 27 of room 1103
厦门火炬高新区软件园三期溪西山尾路 63 号 1103 室之二十七
Email: info@xl-jixie.com
Tel: 0086 17700089421
we also sell Stamping die and other high quality Injection mould
